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| Preparing to apply the solder paste |
I now have the stencils through which solder paste is applied to the printed circuit board ( PCB ). The material is 0.1mm thick stainless steel. Manufactured using a laser cutting process, the minimum cut-out dimension and spacing is also 0.1mm. However the steel was far more suitable for laser cutting than the transparencies, mylar and plastic materials which were also evaluated.
The PCB is held securely between spare PCBs, or off-cuts of other material having exactly the same thickness as the circuit board; checked with vernier calipers. The stencil is then aligned on top so that the solder pads, ( where the SMT parts will be placed ), are visible, and then one edge is taped down to form a hinge.
I use two spreaders; a small spatula and a plastic card. The spatula is for getting the solder paste out of the pot and, after transferring the paste, the card is used to spread the paste over the stencil. As the paste is not cheap, any excess is returned to the pot.
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